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NCP508 Very Low Noise, Fast Turn On, 50 mA Low Dropout Voltage Regulator
The NCP508 is a 50 mA low noise voltage regulator, designed to exhibit fast turn on time and high ripple rejection. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP508 has been designed for use with ceramic capacitors. The device is housed in SC-88A and WDFN6 1.5x1.5 packages. Standard voltage versions are 1.5, 1.8, 2.5, 2.8, 3.0, and 3.3. Other voltages are available in 100 mV steps.
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5 4 12 3
MARKING DIAGRAM
5 xxx MG G M
SC70-5/SC-88A/SOT-353 SQ SUFFIX CASE 419A
1
* * * * * * * *
Very Low Noise at 39 mVrms without a Bypass Capacitor High Ripple Rejection of 70 dB at 1 kHz Low Dropout Voltage of 140 mV (typ) at 30 mA Tight Load Regulation, typically 6 mV for DIout = 50 mA Fast Enable Turn-On time of 20 msec Logic Level Enable ESR can vary from a few mW to 3 W These are Pb-Free Devices
XXX = Specific Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location.
WDFN6 MN SUFFIX CASE 511BJ
1 XX MG
Typical Applications
* RF Subsystems in Handsets * Noise Sensitive Circuits; VCOs, PLL
Battery or Unregulated Voltage 1 C1 1m 2 3 4 5 Vout C2 1m
XX = Specific Device Code M = Date Code G = Pb-Free Package
PIN CONNECTIONS
Vin GND Enable 1 2 3 SC-88A (Top View) 4 NC 5 Vout
ON OFF
Figure 1. Typical Application Diagram
Vout NC GND 1 2 3
6 5 4 WDFN6 (Top View)
Vin NC Enable
See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet.
ORDERING INFORMATION
(c) Semiconductor Components Industries, LLC, 2010
May, 2010 - Rev. 3
1
Publication Order Number: NCP508/D
NCP508
PIN FUNCTION DESCRIPTION
Pin No. 1 2 3 4 5 Pin Name Vin GND Enable N/C Vout Positive power supply input voltage Power supply ground This input is used to place the device into low-power stand by. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. Not connected pin Regulated output voltage Description
MAXIMUM RATING
Rating Input Voltage Enable Voltage Output Voltage Power Dissipation and Thermal Characteristics (SC-88A) Power Dissipation Thermal Resistance, Junction-to-Ambient (Note 4) Power Dissipation and Thermal Characteristics (WDFN6) Power Dissipation Thermal Resistance, Junction-to-Ambient (Note 4) Maximum Junction Temperature Operating Ambient Temperature Storage Temperature Lead Soldering Temperature @ 260C Symbol Vin(max) Enable Vout PD RqJA PD RqJA TJ TA Tstg Tsolder Value 13.0 -0.3 to Vin(max) + 0.3 -0.3 to Vin(max) + 0.3 Internally Limited 200 Internally Limited 313 +125 -40 to +85 -55 to +150 10 Unit V V V W C/W W C/W C C C sec
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL-STD-883, Method 3015. Machine Model Method 200 V 2. Latch up Capability (85C) $ 100 mA DC with trigger voltage 3. Maximum package power dissipation limits must be observed.
PD +
T J(max) * T A R qJA
4. RqJA on a 30 x 30 mm PCB Cu thickness 1 oz; TA = 25C.
RECOMMENDED OPERATING CONDITIONS
Rating Maximum Operating Input Voltage Symbol Vin Max 7.0 Unit V
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NCP508
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom) + 1.0 V, Venable = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25C, unless otherwise
noted) Characteristic Output Voltage Tolerance (TA = 25C, Iout = 10 mA) Output Voltage Tolerance (TA = -40C to 85C, Iout = 10 mA) Line Regulation (Vin = Vout + 1 V to 12 V, Iout = 10 mA) (Note 5) Load Regulation (Iout = 1.0 mA to 50 mA) (Note 5) Output Current (Vout = Vout(nom) - 0.1 V) Dropout Voltage (Vout = 3.0 V, Measured at Vout - 100 mV) Iout = 30 mA Iout = 40 mA Iout = 50 mA Quiescent Current (Enable Input = 0V) Ground Current (Enable Input = Vin, Vin = Vout + 1 V, Iout = 0 mA) (Enable Input = Vin, Iout = 1 mA) (Enable Input = Vin, Iout = 10 mA) (Enable Input = Vin, Iout = 50 mA) Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Enable Input Current (Venable = 2.4 V) Output Turn On Time (Note 6) Output Short Circuit Current Limit (Vout = 0 V) Ripple Rejection (Vin = Vout(nom) + 1 Vdc + 0.5 Vpp, f = 1 kHz, Io = 10 mA) Output Noise Voltage (f = 100 Hz to 100 kHz) (Vout = 1.5 V) Symbol Vout Vout Regline Regload Iout(nom) Vin-Vout Min -2 -3 - - 50 - - - - - - - - 0.9 - - - 100 - - Typ - - 2 6 - 140 155 180 0.1 145 160 300 1100 - - 8.0 20 250 70 39 Max +2 +3 20 40 - 250 300 - 1 200 260 500 1900 - 0.15 15 - - - - Unit % % mV mV mA mV
IQ IGND
mA mA
Vth(en)
V
Ienable - Iout(max) RR Vn
mA ms mA dB mVrms
5. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 6. Turn on time is defined from Enable at 10% to Vout at 95% nominal value. Min and max values TA = -40C to 85C, Tjmax = 125C. Venable = 0 V to Vin. Cout = 1.0 mF.
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NCP508
TYPICAL CHARACTERISTICS
300 Vin-Vout, DROPOUT VOLTAGE (mV) 250 200 150 100 50 0 -40 Vout = Vout(nom) - 0.1 V Iload = 40 mA Vin-Vout, DROPOUT VOLTAGE (mV) 300 250 200 150 100 50 0 -40 Vout = Vout(nom) - 0.1 V Iload = 40 mA
-20
0
20
40
60
80
100
120
-20
0
20
40
60
80
100
120
TEMPERATURE (C)
TEMPERATURE (C)
Figure 2. Dropout Voltage vs. Temperature, 1.5 V
Figure 3. Dropout Voltage vs. Temperature, 3.3 V
1.506 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 1.504 1.502 1.5 1.498 1.496 1.494 1.492 1.49 -40 -20 0 20 40 60 80 100 120 Vout = Vout(nom) + 1 V Iload = 1 mA
3.32 3.315 3.31 3.305 3.3 3.295 3.29
Vout = Vout(nom) + 1 V Iload = 1 mA
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (C)
TEMPERATURE (C)
Figure 4. Output Voltage vs. Temperature, 1.5 V
230 Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA) 220 210 200 190 180 170 160 150 -40 -20 0 20 40 60 80 100 120 Vout = Vout(nom) - 0.1 V 200 150 100 50 0 -40 250
Figure 5. Output Voltage vs. Temperature, 3.3 V
Vout = Vout(nom) - 0.1 V
-20
0
20
40
60
80
100
120
TEMPERATURE (C)
TEMPERATURE (C)
Figure 6. Output Current Limit vs. Temperature, 1.5 V
Figure 7. Output Current Limit vs. Temperature, 3.3 V
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NCP508
TYPICAL CHARACTERISTICS
330 310 Iout(max), SHORT-CIRCUIT CURRENT (mA) 290 270 250 230 210 190 170 150 -40 -20 0 20 40 60 80 100 120 400 350 Iout(max), SHORT-CIRCUIT CURRENT (mA) 300 250 200 150 100 50 0 -40 -20 0 20 40 60 80 100 120
Vout = 0 V
Vout = 0 V
TEMPERATURE (C)
TEMPERATURE (C)
Figure 8. Short-Circuit Current Limit vs. Temperature, 1.5 V
300 IQ, QUIESCENT CURRENT (nA) 250 200 150 100 50 0 -40 IQ, QUIESCENT CURRENT (nA) VEN = 0 V 450 400 350 300 250 200 150 100 50 0 -40
Figure 9. Short-Circuit Current Limit vs. Temperature, 3.3 V
VEN = 0 V
-20
0
20
40
60
80
100
120
-20
0
20
40
60
80
100
120
TEMPERATURE (C)
TEMPERATURE (C)
Figure 10. Quiescent Current vs. Temperature, 1.5 V
145 IGND, GROUND CURRENT (mA) 140 135 130 125 120 -40 IGND, GROUND CURRENT (mA) Vin = Vout + 1 V Iout = 0 mA 146 144 142 140 138 136 134 132 130
Figure 11. Quiescent Current vs. Temperature, 3.3 V
Vin = Vout + 1 V Iout = 0 mA
-20
0
20
40
60
80
100
120
128 -40
-20
0
20
40
60
80
100
120
TEMPERATURE (C)
TEMPERATURE (C)
Figure 12. Ground Current vs. Temperature, 1.5 V
Figure 13. Ground Current vs. Temperature, 3.3 V
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NCP508
TYPICAL CHARACTERISTICS
400 350 300 250 Iin, (mA) 200 150 100 50 0 0 1 2 3 4 1V5, No Load 2V8, No Load 3V3, No Load VEN = Vin Iout = 0 mA Cin = Cout = 1 mF TA = 25C Ishort, (mA) 5 6 7 8 9 10 11 12 13 500
VEN = Vin Vout = 0 mA 450 Voltage Option = 1.5 V Cin = Cout = 1 mF TA = 25C 400 350 300 250
2
3
4
5
6
7
8
9
10
11
12
13
Vin, INPUT VOLTAGE (V)
Vin, INPUT VOLTAGE (V)
Figure 14. Quiescent Current vs. Input Voltage
Figure 15. Output Short-Circuit Current vs. Input Voltage
240 DROPOUT VOLTAGE (mV) 220 200 180 160 140 120 100 80 60 40 20 0 0
Cin = Cout = 1 mF TA = 25C
2V8 3V 3V3 2V5 1V8 1V5
0.01
0.02
0.03
0.04
0.05
Figure 16. Dropout Voltage vs. Output Current
Iout, OUTPUT CURRENT (A)
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NCP508
TYPICAL CHARACTERISTICS
1.6 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 2 VEN = Vin Vout = 1.5 V Cin = Cout = 1 mF TA = 25C 4 6 8 10 Vin, INPUT VOLTAGE (V) 12 Iout = 1.0 mA to 50 mA 3.6 3.2 2.8 2.4 2 1.6 1.2 0.8 0.4 0 0 2 VEN = Vin Vout = 3.3 V Cin = Cout = 1 mF TA = 25C 4 6 8 10 Vin, INPUT VOLTAGE (V) 12 Iout = 1.0 mA to 50 mA
Figure 17. Output Voltage vs. Input Voltage
Figure 18. Output Voltage vs. Input Voltage
1.6 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 1.4 1.2 1 0.8 0.6 VEN = Vin Vout = 1.5 V 0.2 Cin = Cout = 1 mF TA = 25C 0 0 0.05 0.1 0.4 Vin = 2.5 V
3.6 3.2 2.8 2.4 2 1.6 1.2 0.8 0.4 0 0 VEN = Vin Vout = 3.3 V Cin = Cout = 1 mF TA = 25C 0.05 0.1 0.15 0.2 0.25 0.3 Iout, OUTPUT CURRENT (A) Vin = 4.3 V
0.15
0.2
0.25
0.3
Figure 19. Output Voltage vs. Output Current
ESR, EQUIVALENT SERIES RESISTANCE (W)
Iout, OUTPUT CURRENT (A)
Figure 20. Output Voltage vs. Output Current
16 14 12 10 8 6 4 2 0 0 Cin = Cout = 1 mF TA = 25C 5 10 15 20 25 30 35 40 45 50 Iout, OUTPUT CURRENT (mA) Region of Stability Region of Instability
Figure 21. Equivalent Series Resistance vs. Output Current, X7R, MLCC Capacitor
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NCP508
TYPICAL CHARACTERISTICS
Input Voltage (V)
3.5
2.5 60 mV 30 mV 0 -30 mV -60 mV
Vout = 1.5 V Vin = 2.5 V to 3.5 V /rate 1 V/ms Iload = 40 mA Cout = 1 mF MLCC
Load Current (mA)
Vout = 1.5 V Vin = 2.5 V Iload = 1 to 50 mA Cout = 1 uF MLCC
20 mV 10 mV
Output Voltage Deviation (mV)
0 -10 mV -20 mV -30 mV
Output Voltage Deviation (mV)
Figure 22. Line Transient Response 1.5 V/40 mA
Figure 23. Load Transient Response 1.5 V
Input voltage (V)
3.5
Vout = 1.5 V Vin = 2.5 V to 3.5 V /rate 1 V/ms Iload = 50 mA Cout = 4.7 mF MLCC
2.5
20 mV 10 mV 0 -10 mV -20 mV
Output Voltage Deviation (mV)
Figure 24. Line Transient Response 1.5 V/50 mA
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NCP508
TYPICAL CHARACTERISTICS
Load Current (mA)
Vout = 3.3 V Vin = 4.3 V Iload = 1 to 40 mA Cout = 1 mF MLCC
Input Voltage (V)
5.3
20 mV 10 mV 0 -10 mV -20 mV -30 mV
Output Voltage Deviation (mV)
4.3
Vout = 3.3 V Vin = 4.3 V to 5.3 V /rate 1 V/ms Iload = 40 mA Cout = 1 mF MLCC
40 mV 20 mV 0 -20 mV -40 mV
Output Voltage Deviation (mV)
Figure 25. Load Transient Response 3.3 V
Figure 26. Line Transient Response 3.3 V/40 mA
Input Voltage (V)
5.3
4.3 20 mV
Vout = 3.3 V Vin = 4.3 V to 5.3 V /rate 1 V/ms Iload = 50 mA Cout = 4.7 mF MLCC
Output Voltage Deviation (mV)
10 mV 0 -10 mV -20 mV
Figure 27. Line Transient Response 3.3 V/50 mA
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NCP508
TYPICAL CHARACTERISTICS
3.0E-07 2.5E-07 2.0E-07 (nV/HZ) 1.5E-07 1.0E-07 RMS Noise Value (100 Hz - 100 kHz) = 39 mV 0.5E-07 0.0 10
100
1000
10000
100000
1000000
FREQUENCY (Hz)
90 RR, RIPPLE REJECTION (dB) 80 70 60 50 40 30 20 10 0 10
Figure 28. Output Voltage Noise Vout = 1.5 V, Iout = 40 mA
3.3 V
2.5 V
1.5 V
100
1000
10000
100000
1000000
fripple, RIPPLE FREQUENCY (Hz)
Figure 29. Ripple Rejection vs. Frequency Iout = 40 mA, 0.5 Vpp
Iout = No Load Cin = Cout = 1 mF Vin = VEN = 2.8 V Vout = 1.8 V TA = 25C
Vin = VEN
Iout = 50 mA Cin = Cout = 1 mF Vin = VEN = 2.8 V Vout = 1.8 V TA = 25C
Vin = VEN
Vout
Vout Iin
Iin
Figure 30. Startup, No Load
Figure 31. Startup, Iout = 50 mA
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NCP508
0.06 Iout, OUTPUT CURRENT (A) 0.05 0.04 0.03 0.02 0.01 0
Cin = Cout = 1 mF Vin = VEN = 2.8 V Vout = 2.5 V TA = 25C Ilimit = 180 mA
VEN = Vin Cin = Cout = 1 mF TA = 85C 0 1 2 3 4 5 6 7 8 9 10 11 12 13
50 mA/div
500 ms/div
Vin, INPUT VOLTAGE (V)
Figure 32. Hard Short-Circuit Current (by Copper Wires)
Figure 33. Measured Power Operating Area, 1.5 V, TA = 855C, Vout_drop = max 0.1 V
350 300 250 qJA (C/W) 200 150 100 50 33 x 26 mm 0 PCB Copper Thickness = 1.0 oz 0 PD
0.25 MAX POWER DISSIPATION (W) 0.2 0.15 0.1 0.05 0 100 200 300 400 500 600 700 800 900 1000 COPPER HEAT SPREADER AREA (mm2)
qJA
Figure 34. Evaluation Board
Figure 35. SC70-5 Thermal Resistance vs. Copper Heat Spreader Area
400 350 300 qJA (C/W) 250 200 150 100 50 PCB Copper Thickness = 1.0 oz 0 100 200 300 400 500 600 700 800 900 PCB COPPER HEAT SPREADER AREA (mm2)
Figure 36. WDFN6 Thermal Resistance vs. Copper Heat Spreader Area
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NCP508
DEFINITIONS
Load Regulation Line Regulation
The change in output voltage for a change in output current at a constant temperature.
Dropout Voltage
The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level.
Maximum Power Dissipation
The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected.
Line Transient Response
Typical over and undershoot response when input voltage is excited with a given slope.
Thermal Protection
The maximum total dissipation for which the regulator will operate within its specifications.
Quiescent Current
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 125C, the regulator turns off. This feature is provided to prevent failures from accidental overheating.
Maximum Package Power Dissipation
The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current.
The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 150C. Depending on the ambient power dissipation and thus the maximum available output current.
APPLICATIONS INFORMATION Typical application circuit for the NCP508 series is shown in Figure 1.
Input Decoupling (C1) Hints
An input capacitor of at least 1.0 mF,(ceramic or tantalum) is recommended to improve the transient response of the regulator and/or if the regulator is located more than a few inches from the power source. It will also reduce the circuit's sensitivity to the input line impedance at high frequencies. The capacitor should be mounted with the shortest possible track length directly across the regular's input terminals. Higher values and lower ESR will improve the overall line transient response.
Output Decoupling (C2)
Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible.
Thermal Considerations
The NCP508 is a stable regulator and does not require a minimum output current. Capacitors exhibiting ESRs ranging from a few mW up to 3 W can safely be used. The minimum decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response.
Enable Operation
Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP508 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by:
PD + T J(max) * T A R qJA
(eq. 1)
The enable pin will turn on or off the regulator. The limits of threshold are covered in the electrical specification section of this datasheet. If the enable is not used then the pin should be connected to Vin.
where: - TJ{max) is the maximum allowable junction temperature of the die, which is 150C - TA is the ambient operating temperature - Rqja is dependent on the surrounding PCB layout
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NCP508
ORDERING INFORMATION
Device NCP508SQ15T1G NCP508SQ18T1G NCP508SQ25T1G NCP508SQ28T1G NCP508SQ30T1G NCP508SQ33T1G NCP508MN15TBG NCP508MN18TBG NCP508MN25TBG NCP508MN28TBG NCP508MN30TBG NCP508MN33TBG Nominal Output Voltage 1.5 1.8 2.5 2.8 3.0 3.3 1.5 1.8 2.5 2.8 3.0 3.3 Marking D5A D5C D5D D5E D5F D5G AA AC AD AE AF AG Package SC-88A (Pb-Free) SC-88A (Pb-Free) SC-88A (Pb-Free) SC-88A (Pb-Free) SC-88A (Pb-Free) SC-88A (Pb-Free) WDFN6 (Pb-Free) WDFN6 (Pb-Free) WDFN6 (Pb-Free) WDFN6 (Pb-Free) WDFN6 (Pb-Free) WDFN6 (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NOTE: Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.
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NCP508
PACKAGE DIMENSIONS
SC70-5, SC-88A, SOT-353 SQ SUFFIX CASE 419A-02 ISSUE J
A G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
5
4
S
1 2 3
-B-
D 5 PL
0.2 (0.008)
M
B
M
N J C
DIM A B C D G H J K N S
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025
0.40 0.0157 1.9 0.0748
SCALE 20:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP508
PACKAGE DIMENSIONS
WDFN6 1.5x1.5, 0.5P CASE 511BJ-01 ISSUE O
D A B L1 DETAIL A L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D E e L L1 L2 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 1.50 BSC 1.50 BSC 0.50 BSC 0.40 0.60 --0.15 0.50 0.70
PIN ONE REFERENCE 2X 2X
E
EXPOSED Cu
ALTERNATE TERMINAL CONSTRUCTIONS
0.10 C
0.10 C 0.05 C
TOP VIEW A3 A
DETAIL B
A1
DETAIL B
ALTERNATE CONSTRUCTIONS
0.05 C
NOTE 4
A1 SIDE VIEW
DETAIL A 1 3
C
SEATING PLANE
e
5X
L
L2
6
4
6X
b 0.10 C A B 0.05 C
NOTE 3
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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CC EE
6X
EEE EEE EEE EEE
III III III
MOLD CMPD
A3
RECOMMENDED MOUNTING FOOTPRINT*
0.35 0.73
5X
1.80
0.83
0.50 PITCH
DIMENSIONS: MILLIMETERS
NCP508/D

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